Rudolph Ships New NSX 320 TSV Metrology System to CEA-Leti for Through Silicon Via Process Development

[Business Wire] – Rudolph Technologies, Inc. announced today the sale of its first NSX® 320 TSV Metrology System to CEA-Leti, a leading research organization based in Grenoble, France, which, in the frame of the Nanoelec Research Technology Institute pr more

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